Technical Benefits of this HENZE Boron Nitride Solution:
Heat sinks made from HeBoSint® and HeBoFill®, fillers for polymers, provide
- outstanding electrical insulation
- low dielectric loss
- elevated thermal conductivity
- low thermal expansion
- possibility of simpler and – consequently – cost-saving designs (HeBoSint®)
HENZE offers:
- an unusually broad range of HeBoSint® and HeBoFill® Boron Nitride heat sink and filler materials
- expert advice regarding application of HeBoSint® in thermal management and heat dissipation
- precision manufacture of heat sinks in HeBoSint® to your specifications in our own machine shop at Kempten - in any quantity from prototypes to large scale requirements.
Boron Nitride Heat Sinks and Fillers for Safe Thermal Management in Electronics
Smaller, better – but also hotter.
Miniaturisation of electronic components is advancing steadily with a growing number of components being arranged on similar small surface areas. Simultaneously, the performance requirements of each part is ever increasing. As a result it is getting increasingly more difficult to cool these systems and to electrically insulate the components from each other.
Heat dissipation in micro and power electronics due to superior thermal conductivity of Boron Nitride
Heat sinks made of HeBoSint®, HENZE´s sintered Boron Nitride are highly thermal conductive and have proven their worth in electronic systems many times over.
HeBoSint® is much easier to machine than other materials used in thermal management for heat sinks such as beryllium oxide or aluminium nitride. This allows more flexibility in component design.
When used as filler, HeBoFill® boron nitride powder from HENZE for heat sink compound, increases the thermal conductivity of polymers without reducing their dielectric strength, as would occur with graphite.
Find superior technical solutions in electronics thermal management!
Please contact us.